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| 1 |
层数 |
1－14层 |
| 2 |
板厚度 |
0.4mm－3.2mm |
| 3 |
成品厚度公差(板厚≥0.8mm) |
±10% |
| 4 |
成品厚度公差(0.4mm≤板厚≤0.8mm) |
±3mil(±0.075mm) |
| 5 |
板曲(最大) |
0.75% |
| 6 |
钻孔孔径 |
0.2mm－6.5mm |
| 7 |
最大铜厚(内/外) |
3OZ/3OZ |
| 8 |
绝缘层厚度(最小) |
3mil |
| 9 |
板料类型 |
CEM-3；FR-4；铝基板；无卤 |
| 10 |
孔电镀纵横比 |
≤8:1 |
| 11 |
孔径公差 |
PTH：±3mil NPTH：±2mil |
| 12 |
孔位公差 |
±3mil |
| 13 |
孔壁铜厚 |
≥18um |
| 14 |
外层设计线宽／间距(最小) |
1/1OZ 3.5mil/3.5mil，2/2OZ 5mil/5mil，3/3OZ 6mil/6mil |
| 15 |
内层设计线宽／间距(最小) |
H/HOZ 3mil/3mil，1/1OZ 4mil/4mil，2/2OZ 5mil/5mil，3/3OZ 6mil/6mil |
| 16 |
蚀刻公差 |
≤±20％ |
| 17 |
内、外层阻抗 |
＞55Ω:±10%Ω≤55Ω:±5Ω |
| 18 |
阻焊厚度 |
≥10um |
| 19 |
阻焊桥宽(最小) |
3mil |
| 20 |
字符线宽(最小) |
4mil |
| 21 |
铣外形公差 |
±4mil |
| 22 |
铣外形圆弧(内角最小) |
≥16mil |
| 23 |
V-CUT板厚度(最小) |
0.4mm |
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设备介绍