| 1 |
Layer Count |
1－14 |
| 2 |
PCB Thickness |
0.4mm－3.2mm |
| 3 |
Tolerance of Finished PCB Thickness (≥0.8mm) |
±10% |
| 4 |
Tolerance of Finished PCB Thickness (0.4mm≤T≤0.8mm) |
±3mil(±0.075mm) |
| 5 |
Max. Warpage |
0.75% |
| 6 |
Drill Bit |
0.2mm－6.5mm |
| 7 |
Outer/Inner Copper Thickness(max) |
3OZ/3OZ |
| 8 |
Min. Dielectric Thickness |
3mil |
| 9 |
Base Material |
CEM-3; FR-4; Aluminum Base; Halogen Free |
| 10 |
Aspect Ratio (Through Hole) |
≤8:1 |
| 11 |
Hole Tolerance |
PTH：±3mil NPTH：±2mil |
| 12 |
Hole Registration Tolerance |
±3mil |
| 13 |
Hole Wall Copper Thickness |
≥18um |
| 14 |
Min. Outer Design L/S |
1/1OZ 3.5mil/3.5mil，2/2OZ 5mil/5mil，3/3OZ 6mil/6mil |
| 15 |
Min. Inner Design L/S |
H/HOZ 3mil/3mil，1/1OZ 4mil/4mil，2/2OZ 5mil/5mil，3/3OZ 6mil/6mil |
| 16 |
Etch Tolerance |
≤±20％ |
| 17 |
Impedance for Inner and Outer Layer |
＞55Ω:±10%Ω≤55Ω:±5Ω |
| 18 |
Solder Mask Thickness |
≥10um |
| 19 |
Min. Solder Mask Bridge |
3mil |
| 20 |
Min. Legend Width |
4mil |
| 21 |
Rout Tolerance |
±4mil |
| 22 |
Min. Rout Radius (Internal) |
≥16mil |
| 23 |
Min. V-CUT Board Thickness |
0.4mm |
